In thin film manufacturing of Liquid Crystal Panels and Semiconductors, a method of sputtering evaporates the metal and generates a circuit. The metal (target material) that evaporates when sputtering is very hot, so it cools and proceeds with the production process.
The backing plate is used to cool the target material.
The backing plate is used in the vacuum chamber of the sputtering device, and the material is made of copper and has a water-cooled jacket structure.
The water-cooled jacket is formed by joining the main body and the water-cooled lid with vacuum brazing, electron beam welding, Friction Stirring Welding, etc.
In particular, Friction Stirring Welding system of our own facility is considered to be more reliable at the junction than melt welding when it comes to bonding nonferrous metals, and is actually used for bonding the bodies of aircraft and Shinkansen trains.
Kyoyu Seisakusho's backing plates respond to various types of shapes ranging from round to angular shapes, and advanced distortion correction technology enables surface cutting after welding to maintain a constant thickness of the water-cooled lid, contributing to improved cooling efficiency.
- The material of the Backing Plate is made of copper.
- The welding method adopts either Tig welding, vacuum brazing, EBW, FSW.
- The maximum size that can be manufactured is φ800mm in circles, 1,400mm wide in rectangle, and 2,000mm in length.
- The main structure is the jacket structure, which is grooved and the lid joined from the top.